On Friday, Nvidia and Taiwan Semiconductor Manufacturing Co. (TSMC) confirmed that they have produced the first wafer of Nvidia’s next-generation Blackwell chip in the United States, marking a huge step forward in semiconductor manufacturing and AI development in the U.S., as shared on the company’s official blog.
The announcement took place at TSMC’s Arizona facility, where Nvidia CEO Jensen Huang joined TSMC executives and local officials to celebrate the milestone. The event highlighted what both companies called a defining moment for domestic chipmaking and a tangible leap toward strengthening the U.S. semiconductor supply chain.
“This is a historic moment,” Huang said at the event. “It’s the first time in modern American history that such a vital chip is being manufactured in the U.S. by the world’s most advanced fab, TSMC.”
Ray Chuang, CEO of TSMC Arizona, echoed that sentiment, saying the milestone “represents the very best of TSMC.” He credited the achievement to “three decades of partnership with Nvidia” and the dedication of employees and local partners who helped make the Arizona facility operational in record time.
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In a statement on its blog, Nvidia noted that the initiative “bolsters the U.S. supply chain and onshores the AI technology stack that will turn data into intelligence and secure America’s leadership for the AI era.”
The Arizona plant is expected to manufacture advanced two-, three-, and four-nanometer chips, as well as A16-class processors—components critical to applications across AI, telecommunications, and high-performance computing.
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